|
| 产品详细说明: |
| Technical Features :
?The plated material contains three layers, namely copper, nickel and gold with Ni≥2.5μM, Au≥0.02μM.
?High wear resistance, but relatively poor tin adhesiveness during soldering High
Application:
?Bonding board
?Communication
?Computer card board
?Consumer products
http://huabang88.com/ |
| 产品规格: |
|
|
|
|